Thermal and Computational Fluid Dynamics (CFD) Simulation Engineer

**About Turing:
**Based in San Francisco, California, Turing is the world’s leading research accelerator for frontier AI labs and a trusted partner for global enterprises deploying advanced AI systems.

Role Overview

Responsible for developing and executing thermal and CFD simulation workflows for PCB assemblies and electronic systems, evaluating heat dissipation, temperature distribution and cooling effectiveness, and generating technically validated simulation evidence.

Key Responsibilities

• Perform thermal analysis of PCB assemblies, electronic components and enclosures.
• Analyse heat conduction, convection and, where applicable, radiation.
• Develop CFD models to evaluate airflow, cooling performance and temperature distribution.
• Use OpenFOAM for thermal and CFD simulations.
• Use Gmsh or equivalent open-source tools for geometry preparation and mesh generation.
• Define thermal boundary conditions, material properties, component power losses and simulation parameters.
• Evaluate component and PCB temperatures, thermal hotspots and cooling effectiveness.
• Develop Python-based automation and post-processing workflows.
• Assess mesh independence, convergence and numerical stability.
• Correlate simulation results with analytical calculations and available reference data.
• Document modelling assumptions, limitations, results and verification evidence.

Required Skills

• Strong fundamentals in heat transfer, thermodynamics and fluid mechanics.
• Practical experience in CFD and thermal simulation.
• Knowledge of conduction, natural/forced convection and radiation.
• Experience with OpenFOAM or equivalent CFD tools.
• Familiarity with Gmsh or other mesh-generation tools.
• Understanding of material properties, thermal boundary conditions and heat-source modelling.
• Python scripting for automation and simulation post-processing.
• Ability to interpret simulation results and assess numerical accuracy.

Preferred Qualifications :

• Bachelor's or Master's degree in Mechanical, Thermal, Aerospace or related Engineering.
• 5+ years of relevant experience in CFD, thermal engineering or electronics cooling.
• Experience with PCB thermal analysis, power electronics, semiconductor cooling or electronic enclosures.

Project Details:

• Contract Start Date: Expected to start as soon as possible
• Engagement: ~13 weeks (with potential chances of extension)
• Commitment - 40 hours/week
• Engagement Type: Contract
• Selection process: 1 AI Interview and 1 Interview with our team